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DIC to Participate in TOKYO PACK 2024

A total of 27 products and solutions will be featured, in line with the theme ‘A new step toward sustainable packaging for the future.’

DIC Corporation announced that it will participate, together with subsidiary DIC Graphics Corpo-ration, in the Tokyo International Packaging Exhibition 2024 (TOKYO PACK 2024), which will be held from Oct. 23-25, 2024, at the Tokyo International Exhibition Center (Tokyo Big Sight). The company has also created a dedicated TOKYO PACK 2024 page on its global website that intro-duces the products and solutions displayed at its on-site booth.

The DIC Group deploys a variety of initiatives in the packaging field aimed at contributing to the achievement of sustainability for the earth and society in line with its proprietary 5Rs frame-work, which adds “renew” and “redesign” to the original 3Rs (“reuse, reduce, recycle”).

The DIC Group’s TOKYO PACK 2024 on-site booth and dedicated website page will feature a to-tal of 27 products and solutions, including through a collaborative exhibit with partner compa-nies, in line with the theme “A new step toward sustainable packaging for the future.”
Examples of collaborative exhibit products and solutions include:

• A solution that encourages recycling by combining DIC’s top-seal technologies (including those for easy-peel sealant film) with state-of-the-art printing technologies from a partner company
• An innovative lamination system employing DIC’s DUALAM solvent-fee adhesive that helps reduce CO2 emissions developed jointly with a partner company

A variety of mini-presentations providing useful information for visitors are also scheduled to be held at the DIC Group’s on-site booth.

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